Fully integrated low-loss band-pass filters for wireless applications

Abstract Fully integrated low insertion loss micromachined band-pass filters are designed and fabricated on the silicon substrate (ρ = 10–20 cm, εr = 11.9) for UHF applications. Filters are made of silver, which has the highest conductivity of all metals, to minimize the ohmic loss. A detailed analysis for realizing low insertion loss and high out-of-band rejection filters using elliptic magnitude characteristics is presented, and a comprehensive model to take into account inductive parasitics of the interconnects is developed. Temperature characteristics of the filters are measured and show stable performance. The presented filters are different from the previously reported lumped element filters in that all filters are fully integrated on silicon substrate and occupy a remarkably smaller die area. Two filters are fabricated using the silver micromachining technique with center frequencies at 1.05 and 1.35 GHz. The filters have a constant 3 dB bandwidth of 300 MHz (28.6% and 22.2%) and an insertion loss of 1.4–1.7 dB. The low insertion loss and CMOS compatibility make the presented filters suitable candidates for radio frequency integrated circuits.